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1 min read / May 13, 2026

新思科技AMS Tech Day圆满落幕：AI驱动模拟设计，从方法到实践的最后一公里

By Guanyi Wang

Tags: AI & Machine Learning, Design, Analog Design

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1 min read / Mar 11, 2026

新思科技推出业界首个面向下一代存储的 UFS 5.0 与 M PHY v6.0 完整 IP 解决方案

By LJ Chen

Tags: Interface IP, Silicon IP

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1 min read / Apr 28, 2025

新思科技率先推出汽车领域经认证的TRNG

By Vincent van der Leest , Dana Neustadter

Tags: Synopsys IP Technical Bulletin, Security IP, Automotive, Silicon IP

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1 min read / Apr 28, 2025

3D Multi-Die设计IP

By Rob Kruger

Tags: Multi-Die System, Synopsys IP Technical Bulletin, Interface IP, Silicon IP

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1 min read / Apr 28, 2025

224G SerDes IP如何助力行业向线性驱动光学技术转型

By Keivan Javadi Khasraghi

Tags: Data Center, Synopsys IP Technical Bulletin, Interface IP, Silicon IP

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1 min read / Apr 28, 2025

利用先进OTP IP打造安全可靠的SoC设计

By Krishna Balachandran

Tags: Data Center, Synopsys IP Technical Bulletin, Foundation IP, Silicon IP

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1 min read / Feb 14, 2025

到2025年，至少有一半的新型高性能计算芯片设计将采用2.5D或3D Multi-Die技术

By Shekhar Kapoor , Michael Posner

Tags: Multi-Die

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1 min read / Oct 21, 2024

新思科技与世芯科技携手，以Soft Chiplet革命性简化了Multi-Die设计成功路径

By Manmeet Walia , Erez Shaizaf , Manuel Mota

Tags: Multi-Die, Silicon IP

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1 min read / Mar 28, 2024

小芯片互联迈出关键一步！UCIe IP 成功实现跨厂商互操作

By Manuel Mota

Tags: Silicon IP

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行业趋势

人工智能 | 智能汽车 | 数据中心 | RISC-V

1 min read / May 13, 2026

新思科技AMS Tech Day圆满落幕：AI驱动模拟设计，从方法到实践的最后一公里

By Guanyi Wang

Tags: AI & Machine Learning, Design, Analog Design

Read Article

1 min read / Apr 28, 2025

新思科技率先推出汽车领域经认证的TRNG

By Vincent van der Leest , Dana Neustadter

Tags: Synopsys IP Technical Bulletin, Security IP, Automotive, Silicon IP

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1 min read / Mar 25, 2024

2024冲上热搜的科技爆点：GenAI加入芯片设计与验证

By Stelios Diamantidis

Tags: AI & Machine Learning

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1 min read / Feb 20, 2024

新思科技+英飞凌，携手破解智能汽车密码

By Hezi Saar

Tags: Automotive

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1 min read / Feb 06, 2024

最复杂春运天，把车水马龙龙龙龘龘龘放在“芯”上

By William Ruby

Tags: Automotive

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1 min read / Jan 15, 2024

2024汽车行业新玩法，新老玩家皆宜

By Chris Clark , Stewart Williams

Tags: Automotive

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AI芯片设计及验证

1 min read / May 13, 2026

新思科技AMS Tech Day圆满落幕：AI驱动模拟设计，从方法到实践的最后一公里

By Guanyi Wang

Tags: AI & Machine Learning, Design, Analog Design

Read Article

1 min read / Feb 21, 2024

新思科技与三星联手给出5nm移动低功耗芯片一次性流片成功的解题思路

By Chiragkumar Patel , Avinash Palepu

Tags: Verification

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1 min read / Jan 30, 2024

RISC-V HPC内核从5nm迁移到4nm，1个月还是2天？

By Manas Ranjan Raiguru

Tags: Verification

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1 min read / Jan 23, 2024

低功耗仿真必须要克服的X问题

By Rob van Blommestein

Tags: Verification

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1 min read / Jan 22, 2024

低功耗探索不能停，用高能效SoC建设节能未来

By William Ruby

Tags: Design

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1 min read / Sep 25, 2023

Synopsys.ai再拓新版图！新思科技发布业界首个全栈式大数据分析解决方案

By Rikki Lu

Tags: Design, About Synopsys, Verification

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1 min read / Sep 19, 2023

提高效率，突破创新：微软和意法半导体凭什么？

By Rikki Lu

Tags: Cloud, AI & Machine Learning, Design, About Synopsys, Verification

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1 min read / Sep 13, 2023

新思科技和三星强强联手，加速先进工艺下多裸晶芯片系统设计

By Rikki Lu

Tags: Design, About Synopsys, Silicon IP, Verification

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1 min read / Sep 05, 2023

基于VC Formal，在RISC-V内核上，验证一波！

By Rikki Lu

Tags: About Synopsys, Verification

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IP

1 min read / Mar 11, 2026

新思科技推出业界首个面向下一代存储的 UFS 5.0 与 M PHY v6.0 完整 IP 解决方案

By LJ Chen

Tags: Interface IP, Silicon IP

Read Article

1 min read / Apr 28, 2025

224G SerDes IP如何助力行业向线性驱动光学技术转型

By Keivan Javadi Khasraghi

Tags: Data Center, Synopsys IP Technical Bulletin, Interface IP, Silicon IP

Read Article

1 min read / Apr 28, 2025

新思科技率先推出汽车领域经认证的TRNG

By Vincent van der Leest , Dana Neustadter

Tags: Synopsys IP Technical Bulletin, Security IP, Automotive, Silicon IP

Read Article

1 min read / Apr 28, 2025

利用先进OTP IP打造安全可靠的SoC设计

By Krishna Balachandran

Tags: Data Center, Synopsys IP Technical Bulletin, Foundation IP, Silicon IP

Read Article

1 min read / Apr 28, 2025

3D Multi-Die设计IP

By Rob Kruger

Tags: Multi-Die System, Synopsys IP Technical Bulletin, Interface IP, Silicon IP

Read Article

1 min read / Oct 21, 2024

新思科技与世芯科技携手，以Soft Chiplet革命性简化了Multi-Die设计成功路径

By Manmeet Walia , Erez Shaizaf , Manuel Mota

Tags: Multi-Die, Silicon IP

Read Article

1 min read / Mar 28, 2024

小芯片互联迈出关键一步！UCIe IP 成功实现跨厂商互操作

By Manuel Mota

Tags: Silicon IP

Read Article

1 min read / Jan 28, 2024

开箱即用，为DDR DRAM一键开启硬件保护罩

By Dana Neustadter , Brett Murdock

Tags: Silicon IP

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1 min read / Jan 11, 2024

LPDDR5X来袭！准备迎接内存速度大爆炸

By Graham Allan

Tags: Silicon IP

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Multi-Die系统

1 min read / Apr 28, 2025

3D Multi-Die设计IP

By Rob Kruger

Tags: Multi-Die System, Synopsys IP Technical Bulletin, Interface IP, Silicon IP

Read Article

1 min read / Feb 14, 2025

到2025年，至少有一半的新型高性能计算芯片设计将采用2.5D或3D Multi-Die技术

By Shekhar Kapoor , Michael Posner

Tags: Multi-Die

Read Article

1 min read / Oct 21, 2024

新思科技与世芯科技携手，以Soft Chiplet革命性简化了Multi-Die设计成功路径

By Manmeet Walia , Erez Shaizaf , Manuel Mota

Tags: Multi-Die, Silicon IP

Read Article

1 min read / Feb 27, 2024

不是系统改版做不起，而是提前架构探索更有性价比

By Kamal Desai

Tags: Multi-Die

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1 min read / Feb 07, 2024

都是3D封装，飞在天上的芯片和地上的有什么不一样？

By Kenneth Larsen , Ian Land , Rob Aitken

Tags: Multi-Die

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1 min read / Jan 12, 2024

万物智能时代，2024 年关于Multi-Die系统的四大猜想

By Shekhar Kapoor

Tags: Multi-Die

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1 min read / Dec 26, 2023

从数月到几小时，这枚Multi-Die系统芯片是如何快速交付的？

By Filip Thoen , Leonard Drucker , Vivek Prasad

Tags: Multi-Die

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1 min read / Dec 12, 2023

Multi-Die系统验证很难吗

By Arturo Salz , Johannes Stahl

Tags: Multi-Die

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1 min read / Sep 26, 2023

VCS：助力英伟达开启Multi-Die系统仿真二倍速

By Rikki Lu

Tags: Multi-Die

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